Patent Assignment
Reel/Frame 054539/0394
Assignment of Assignor's Interest
Recorded: 2020-12-03
Pages: 4
Assignors
YU, CHENG-FEI
Executed: 2020-11-06
TSAO, CHANG-CHEN
Executed: 2020-11-24
SHIU, TING-YAU
Executed: 2020-11-09
HU, CHENG-KANG
Executed: 2020-11-09
LIU, HSU-SHUI
Executed: 2020-11-06
PAI, JIUN-RONG
Executed: 2020-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fully Automated Wafer Debonding System and Method Thereof