Patent Assignment
Reel/Frame 054563/0202
Assignment of Assignor's Interest
Recorded: 2020-12-07
Pages: 8
Assignors
VINCENT, MICHAEL B.
Executed: 2020-12-03
HAYES, SCOTT M.
Executed: 2020-12-03
GONG, ZHIWEI
Executed: 2020-12-03
MIRPURI, KABIR
Executed: 2020-12-03
TANK, RUSHIK P.
Executed: 2020-12-03
YEUNG, BETTY HILL-SHAN
Executed: 2020-12-03
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor