Patent Assignment
Reel/Frame 054563/0291
Assignment of Assignor's Interest
Recorded: 2020-12-07
Pages: 8
Assignors
LEUTEN, TYLER
Executed: 2020-12-03
XU, YI
Executed: 2020-12-04
RABADAM, ELEANOR PATRICIA PARAS
Executed: 2020-12-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Through-Substrate Void Filling for an Integrated Circuit Assembly
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 18, 2025
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 072293/0842 →
Corrective Assignment to Correct the Application Numbers Incorrectly Listed (Remove 17236651, 17411919, 17483279, 17558001) Previously Recorded on Reel 72293 Frame 842. Assignor(S) Hereby Confirms the Assignment.
Apr 1, 2026
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 075695/0416 →