Patent Assignment
Reel/Frame 072293/0842
Assignment of Assignor's Interest
Recorded: 2025-09-18
Pages: 13
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
INTEL NDTM US LLC
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(15)
Ferroelectric Layer with Domains Stabilized by Strain
Germanium on Insulator (Goi) Semiconductor Substrates
Non-Linear Fin-Based Devices
Technology To Facilitate Rapid Booting With High-Speed And Low-Speed Nonvolatile Memory
Microelectronic Packages Having a Die Stack and a Device Within the Footprint of the Die Stack
Transistors Employing Non-Selective Deposition of Source/Drain Material
Field Defect Transistors with Reduced Electric Field by Thickening Dielectric on the Drain Side
Through-Substrate Void Filling for an Integrated Circuit Assembly
Cache Processes with Adaptive Dynamic Start Voltage Calculation for Memory Devices
Staggered Active Bitline Sensing
Dynamic Gate Steps for Last-Level Programming to Improve Write Performance
Block List Management for Wordline Start Voltage
Method and Apparatus for Improving Write Uniformity in a Memory Device
Tier Expansion Offset
Microelectronic Packages Having a Die Stack and a Device Within the Footprint of the Die Stack
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2008
From: PILLARISETTY, RAVI; JIN, BEEN-YIH; RACHMADY, WILLY; RADOSAVLJEVIC, MARKO
To: INTEL CORPORATION
Reel/Frame 021506/0143 →
Assignment of Assignor's Interest
Sep 24, 2009
From: MA, QING; WANG, LI-PENG; RAO, VALLURI
To: INTEL CORPORATION
Reel/Frame 023278/0747 →
Assignment of Assignor's Interest
Apr 12, 2017
From: ROTHMAN, MICHAEL A.; ZIMMER, VINCENT J.; MUDUSURU, GIRI P.; YAO, JIEWEN
To: INTEL CORPORATION
Reel/Frame 041972/0196 →
Assignment of Assignor's Interest
Dec 7, 2020
From: LEUTEN, TYLER; XU, YI; RABADAM, ELEANOR PATRICIA PARAS
To: INTEL CORPORATION
Reel/Frame 054563/0291 →
Assignment of Assignor's Interest
Mar 25, 2021
From: YANG, XIANG; KHAKIFIROOZ, ALI; KALAVADE, PRANAV; RAJWADE, SHANTANU R.
To: INTEL CORPORATION
Reel/Frame 055725/0924 →
Assignment of Assignor's Interest
Apr 27, 2021
From: JAMBUNATHAN, KARTHIK; MADDOX, SCOTT J.; JHAVERI, RITESH; PATEL, PRATIK A.
To: INTEL CORPORATION
Reel/Frame 056059/0914 →
Assignment of Assignor's Interest
Sep 22, 2021
From: UPADHYAY, SAGAR; TANKASALA, ARCHANA; MADRASWALA, ALIASGAR S.; RAJWADE, SHANTANU
To: INTEL CORPORATION
Reel/Frame 057561/0253 →
Assignment of Assignor's Interest
Jan 6, 2022
From: CHENG, LI
To: INTEL CORPORATION
Reel/Frame 058649/0122 →
Assignment of Assignor's Interest
Mar 10, 2022
From: RAJWADE, SHANTANU R.; MION, CHRISTIAN; KALAVADE, PRANAV; SHENOY, ROHIT S.
To: INTEL CORPORATION
Reel/Frame 059230/0253 →
Assignment of Assignor's Interest
Mar 23, 2022
From: UPADHYAY, SAGAR; MADRASWALA, ALIASGAR S.; CHAVA, PRANAV
To: INTEL CORPORATION
Reel/Frame 059382/0471 →
Assignment of Assignor's Interest
Mar 30, 2022
From: LI, CHENG
To: INTEL CORPORATION
Reel/Frame 059587/0082 →
Corrective Assignment to Correct the Assignment Signature Date of Pranav Kalavade Previously Recorded on Reel 055725 Frame 0924. Assignor(S) Hereby Confirms the Assignment.
Jun 7, 2023
From: YANG, XIANG; KHAKIFIROOZ, ALI; KALAVADE, PRANAV; RAJWADE, SHANTANU R.
To: INTEL CORPORATION
Reel/Frame 064020/0361 →
Assignment of Assignor's Interest
Mar 19, 2024
From: KHAKIFIROOZ, ALI; HAQUE, REZAUL; KULKARNI, DHANASHREE; NASRI, BAYAN
To: INTEL CORPORATION
Reel/Frame 066822/0162 →
Assignment of Assignor's Interest
May 2, 2024
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 067305/0491 →
Corrective Assignment to Correct the Application Numbers Incorrectly Listed (Remove 17236651, 17411919, 17483279, 17558001) Previously Recorded on Reel 72293 Frame 842. Assignor(S) Hereby Confirms the Assignment.
Apr 1, 2026
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 075695/0416 →