Patent Assignment
Reel/Frame 054563/0961
Assignment of Assignor's Interest
Recorded: 2020-12-07
Pages: 3
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Wafer, Semiconductor Chip, and Dicing Method