Patent Assignment
Reel/Frame 054563/0986
Assignment of Assignor's Interest
Recorded: 2020-12-07
Pages: 6
Assignors
LEE, DONG-SIK
Executed: 2020-08-02
LEE, BYUNGJIN
Executed: 2020-08-10
HWANG, SUNG-MIN
Executed: 2020-08-03
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device and Method of Fabricating the Same