Patent Assignment
Reel/Frame 054571/0045
Assignment of Assignor's Interest
Recorded: 2020-12-08
Pages: 6
Assignors
ISHIKAWA, SHINYA
Executed: 2020-11-20
ONO, KENTA
Executed: 2020-11-25
TOMURA, MAJU
Executed: 2020-11-25
HONDA, MASANOBU
Executed: 2020-11-26
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME,, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method, Substrate Processing Apparatus, and Substrate Processing System