Patent Assignment
Reel/Frame 054576/0314
Assignment of Assignor's Interest
Recorded: 2020-12-08
Pages: 5
Assignors
HSIAO, SHENG-TSUNG
Executed: 2020-11-27
WANG, JEN YU
Executed: 2020-11-27
WU, CHUNG-JUNG
Executed: 2020-11-27
SHAO, TUNG-LIANG
Executed: 2020-11-30
TUNG, CHIH-HANG
Executed: 2020-11-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same