Patent Assignment
Reel/Frame 054606/0509
Assignment of Assignor's Interest
Recorded: 2020-12-10
Pages: 9
Assignors
LIM, MIN SUET
Executed: 2020-09-22
GOH, ENG HUAT
Executed: 2020-09-28
HOSSAIN, MD ALTAF
Executed: 2020-09-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Reverse-Bridge Multi-Die Interconnect for Integrated-Circuit Packages