Patent Assignment
Reel/Frame 054642/0879
Assignment of Assignor's Interest
Recorded: 2020-12-14
Pages: 3
Assignors
KUO, HUNG-JUI
Executed: 2020-11-19
TSAI, HUI-JUNG
Executed: 2020-10-14
CHANG, TAI-MIN
Executed: 2020-10-24
WANG, CHIA-WEI
Executed: 2020-10-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit, Package Structure, and Manufacturing Method of Package Structure