Patent Assignment
Reel/Frame 054643/0374
Assignment of Assignor's Interest
Recorded: 2020-12-14
Pages: 3
Assignor
KUO, CHIH-WEI
Executed: 2020-12-09
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same