Patent Assignment
Reel/Frame 054659/0887
Assignment of Assignor's Interest
Recorded: 2020-12-16
Pages: 3
Assignor
HAMAGUCHI, HIROKI
Executed: 2020-11-13
Assignee
SODICK CO., LTD.
3-12-1, NAKAMACHIDAI, TSUZUKI-KU, YOKOHAMA,, KANAGAWA, 224-8522, JAPAN
Covered Property
(1)
Mold Clamping Device of Injection Molding Machine and Method of Adjusting Mold Thickness of Mold Clamping Device