IP Library › Assignment 054663/0070
Patent Assignment
Reel/Frame 054663/0070

Assignment of Assignor's Interest

Recorded: 2020-12-09 Pages: 8
Assignors
KIM, SUNGHA
Executed: 2020-11-10
KIM, HYOUNGGON
Executed: 2020-11-11
CHO, DOOHYUN
Executed: 2020-11-10
LEE, KWANGSUNG
Executed: 2020-11-11
KIM, JONGSU
Executed: 2020-11-11
KIM, TAEJOONG
Executed: 2020-11-10
HA, JEONGSU
Executed: 2020-11-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Wafer Inspection Apparatus and Method
Application: 17/116,708 →
Publication: US 2021/0341396