Patent Assignment
Reel/Frame 054668/0587
Assignment of Assignor's Interest
Recorded: 2020-12-16
Pages: 3
Assignors
FUERGUT, EDWARD
Executed: 2020-12-14
JOANNA CHYE, JO EAN
Executed: 2020-12-14
OTREMBA, RALF
Executed: 2020-12-14
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Molded Semiconductor Package with Dual Integrated Heat Spreaders