Patent Assignment
Reel/Frame 054695/0401
Assignment of Assignor's Interest
Recorded: 2020-12-18
Pages: 5
Assignors
YEH, SHU-SHEN
Executed: 2020-11-23
YANG, CHE-CHIA
Executed: 2020-12-18
WANG, CHIN-HUA
Executed: 2020-11-23
LIN, PO-YAO
Executed: 2020-11-23
JENG, SHIN-PUU
Executed: 2020-11-23
LIN, CHIA-HSIANG
Executed: 2020-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacking Via Structures for Stress Reduction