IP Library Assignment 054746/0487
Patent Assignment
Reel/Frame 054746/0487

Assignment of Assignor's Interest

Recorded: 2020-12-24 Pages: 8
Assignors
PATIL, ANIKET
Executed: 2020-11-20
WE, HONG BOK
Executed: 2020-11-24
KIM, JONGHAE
Executed: 2020-11-25
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Thermal Mitigation Die Using Back Side Etch
Application: 16/883,812 →
Publication: US 2021/0375712