Patent Assignment
Reel/Frame 054757/0141
Assignment of Assignor's Interest
Recorded: 2020-12-28
Pages: 3
Assignors
CHEN, MING-FA
Executed: 2020-12-20
WANG, CHIN-SHYH
Executed: 2020-12-23
SHIH, CHAO-WEN
Executed: 2020-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Liner TSV Structure and Method Forming Same