Patent Assignment
Reel/Frame 054771/0075
Assignment of Assignor's Interest
Recorded: 2020-12-29
Pages: 3
Assignor
YANG, PO-YU
Executed: 2020-12-28
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Die and Manufacturing Method of Semiconductor Device