IP Library Assignment 054778/0207
Patent Assignment
Reel/Frame 054778/0207

Assignment of Assignor's Interest

Recorded: 2020-12-30 Pages: 3
Assignors
CHEN, EUGENE I-CHUN
Executed: 2020-12-11
LEE, RU-LIANG
Executed: 2020-12-11
TSAI, CHIA-SHIUNG
Executed: 2020-12-11
CHIANG, CHEN-HAO
Executed: 2020-12-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusion Barrier Layer
Application: 17/138,121 →
Publication: US 2022/0028994