Patent Assignment
Reel/Frame 054783/0309
Assignment of Assignor's Interest
Recorded: 2020-12-31
Pages: 4
Assignors
WANG, SHENG-CHEN
Executed: 2020-12-20
YANG, FENG-CHENG
Executed: 2020-12-15
LIN, MENG-HAN
Executed: 2020-12-15
CHIA, HAN-JONG
Executed: 2020-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Novel 3D Ram Sl/Bl Contact Modulation