Patent Assignment
Reel/Frame 054785/0223
Assignment of Assignor's Interest
Recorded: 2020-12-31
Pages: 4
Assignors
CHIOU, WEN-CHIH
Executed: 2020-12-23
YU, CHEN-HUA
Executed: 2020-12-23
LIN, SHIH TING
Executed: 2020-12-29
LU, SZU-WEI
Executed: 2020-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method