Patent Assignment
Reel/Frame 054804/0009
Assignment of Assignor's Interest
Recorded: 2021-01-04
Pages: 3
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., ZHONGLI DIST., TAOYUAN CITY, 320, TAIWAN
Covered Property
(1)
Chip Package Including Substrate Having Inclined Sidewall and Redistribution Line