Patent Assignment
Reel/Frame 054805/0366
Assignment of Assignor's Interest
Recorded: 2021-01-04
Pages: 3
Assignor
LU, WEN-LONG
Executed: 2020-12-21
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same