Patent Assignment
Reel/Frame 054825/0898
Assignment of Assignor's Interest
Recorded: 2021-01-06
Pages: 5
Assignors
LIANG, SHUEN-SHIN
Executed: 2020-11-24
TSAI, CHUN-I
Executed: 2020-11-24
CHANG, CHIH-WEI
Executed: 2020-11-24
HUANG, CHUN-HSIEN
Executed: 2020-11-24
HUANG, HUNG-YI
Executed: 2020-11-24
LIN, KENG-CHU
Executed: 2020-11-24
CHANG, KEN-YU
Executed: 2020-11-24
WANG, SUNG-LI
Executed: 2020-11-24
CHU, CHIA-HUNG
Executed: 2020-11-24
CHANG, HSU-KAI
Executed: 2020-11-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Capping Layer for Liner-Free Conductive Structures