Patent Assignment
Reel/Frame 054830/0976
Assignment of Assignor's Interest
Recorded: 2021-01-06
Pages: 4
Assignors
CHEN, HSIA-WEI
Executed: 2020-12-09
SUNG, FU-TING
Executed: 2020-12-10
LIAO, YU-WEN
Executed: 2020-12-10
CHU, WEN-TING
Executed: 2020-12-10
JIANG, FA-SHEN
Executed: 2020-12-09
YEH, TZU-HSUAN
Executed: 2020-12-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Fabricating Integrated Circuit Device