Patent Assignment
Reel/Frame 054839/0195
Assignment of Assignor's Interest
Recorded: 2021-01-07
Pages: 7
Assignors
YOO, JAEKYUNG
Executed: 2020-12-02
LEE, JAYEON
Executed: 2020-12-02
LEE, JAE-EUN
Executed: 2020-12-02
KO, YEONGKWON
Executed: 2020-12-02
PARK, JIN-WOO
Executed: 2020-12-02
LEE, TEAK HOON
Executed: 2020-12-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same