Patent Assignment
Reel/Frame 054844/0195
Assignment of Assignor's Interest
Recorded: 2021-01-07
Pages: 5
Assignors
LIAO, CHUN-HUNG
Executed: 2020-11-11
HUANG, LIN-YU
Executed: 2020-12-28
CHANG, CHIA-HAO
Executed: 2020-11-11
CHAO, HUANG-LIN
Executed: 2020-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device Structure with Source/Drain Contact