IP Library Assignment 054849/0119
Patent Assignment
Reel/Frame 054849/0119

Assignment of Assignor's Interest

Recorded: 2021-01-07 Pages: 5
Assignors
HIEMSTRA, SHELDON G.
Executed: 2020-12-11
GARAG, VEERESH
Executed: 2020-12-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Encoded on-Die Termination for Efficient Multipackage Termination
Application: 17/120,729 →
Publication: US 2021/0175887
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072890/0093 →