Patent Assignment
Reel/Frame 054862/0723
Assignment of Assignor's Interest
Recorded: 2021-01-08
Pages: 4
Assignors
YANG, CHE WEI
Executed: 2021-01-05
LI, SHENG-CHAN
Executed: 2021-01-05
TSAO, TSUN-KAI
Executed: 2021-01-03
SHIH, CHIH CHENG
Executed: 2021-01-04
CHEN, SHENG-CHAU
Executed: 2021-01-04
TSAI, CHENG-YUAN
Executed: 2021-01-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Composite Deep Trench Isolation Structure in an Image Sensor