Patent Assignment
Reel/Frame 054868/0363
Assignment of Assignor's Interest
Recorded: 2021-01-10
Pages: 4
Assignors
HUANG, LIN-YU
Executed: 2020-12-08
YU, LI-ZHEN
Executed: 2020-12-06
CHUANG, CHENG-CHI
Executed: 2020-12-06
CHENG, KUAN-LUN
Executed: 2020-12-06
WANG, CHIH-HAO
Executed: 2020-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PAPRK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same