Patent Assignment
Reel/Frame 054882/0139
Assignment of Assignor's Interest
Recorded: 2021-01-11
Pages: 4
Assignor
LO, YI-JEN
Executed: 2021-01-07
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST.,, NEW TAIPEI CITY, 24352, TAIWAN
Covered Property
(1)
Wafer-To-Wafer Interconnection Structure and Method of Manufacturing the Same