IP Library › Assignment 054887/0219
Patent Assignment
Reel/Frame 054887/0219

Corrective Assignment to Correct the Application Number 16585674 Previously Recorded at Reel: 052496 Frame: 0927. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2021-01-03 Pages: 13
Assignors
JANG, JONG MIN
Executed: 2020-04-13
KIM, CHANG YEON
Executed: 2020-04-13
YANG, MYOUNG HAK
Executed: 2020-04-13
Assignee
SEOUL VIOSYS CO., LTD.
65-15, SANDAN-RO 163 BEON-GIL, DANWON-GU, GYEONGGI-DO, ANSAN-SI, KOREA, REPUBLIC OF
Covered Property (1)
Led Chip Package and Manufacturing Method of the Same
Application: 16/858,674 →
Publication: US 2020/0365649
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2020
From: JANG, JONG MIN; KIM, CHANG YEON; YANG, MYOUNG HAK
To: SEOUL VIOSYS CO., LTD.
Reel/Frame 052496/0927 →