Patent Assignment
Reel/Frame 054909/0902
Assignment of Assignor's Interest
Recorded: 2021-01-13
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD., HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof