Patent Assignment
Reel/Frame 054919/0828
Assignment of Assignor's Interest
Recorded: 2021-01-14
Pages: 5
Assignors
PARK, JONG HWI
Executed: 2021-01-12
KO, SANG KI
Executed: 2021-01-12
KU, KAP-RYEOL
Executed: 2021-01-12
KIM, JUNG-GYU
Executed: 2021-01-12
YANG, EUN SU
Executed: 2021-01-12
LEE, YEON SIK
Executed: 2021-01-12
Assignee
SKC CO., LTD.
84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer, Epitaxial Wafer, Method for Manufacturing a Wafer and Method for Manufacturing an Epitaxial Wafer
Application:
17/148,864 →
Publication:
US 2021/0272793
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 13, 2021
From: SKC CO., LTD.
To: SENIC INC.
Reel/Frame 057788/0414 →
Change of Address
Jan 5, 2022
From: SENIC INC.
To: SENIC INC.
Reel/Frame 058645/0149 →
Corrective Assignment to Correct the Execution Date of Change of Address for Assignee Previously Recorded at Reel: 058645 Frame: 0149. Assignor(S) Hereby Confirms the Change of Address..
Apr 10, 2022
From: SENIC INC.
To: SENIC INC.
Reel/Frame 059852/0027 →