Patent Assignment
Reel/Frame 054941/0025
Assignment of Assignor's Interest
Recorded: 2021-01-18
Pages: 3
Assignor
CHOU, YI CHUN
Executed: 2021-01-12
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Including Multiple Substrates Connected Through Via