Patent Assignment
Reel/Frame 054960/0854
Assignment of Assignor's Interest
Recorded: 2021-01-20
Pages: 4
Assignors
HUANG, YU-LIEN
Executed: 2021-01-20
FU, CHING-FENG
Executed: 2020-12-27
LIN, HUAN-JUST
Executed: 2020-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Middle-Of-Line Interconnect Structure and Manufacturing Method