Patent Assignment
Reel/Frame 054974/0717
Assignment of Assignor's Interest
Recorded: 2021-01-20
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure Including Shielding Layer Contacting Conductive Contact