Patent Assignment
Reel/Frame 055020/0361
Assignment of Assignor's Interest
Recorded: 2021-01-25
Pages: 8
Assignors
QUINONES, MARIA CLEMENS YPIL
Executed: 2021-01-05
DOSDOS, BIGILDIS
Executed: 2020-12-17
TEYSSEYRE, JEROME
Executed: 2021-01-08
ALMARGO, ERWIN IAN VAMENTA
Executed: 2020-12-23
MANATAD, ROMEL N
Executed: 2020-12-23
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Molded Packaging for Wide Band Gap Semiconductor Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 15, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 056595/0177 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →