Patent Assignment
Reel/Frame 056595/0177
Security Interest
Recorded: 2021-06-15
Pages: 16
Assignor
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2021-05-06
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(95)
Non-Linear Hemt Devices
Low-Latency Communication Protocol for Binaural Applications
Image Sensor Package Having Inner and Outer Joint Members
Application:
17/143,341 →
Publication:
US 2022/0216255
Termination Structure for Insulated Gate Semiconductor Device and Method
Backside Illuminated Image Sensors with Pixels That Have High Dynamic Range, Dynamic Charge Overflow, and Global Shutter Scanning
Application:
17/147,194 →
Publication:
US 2021/0136299
Multichannel Minimum Distance Chirp Echo Detection
Centralized Occupancy Detection System
Image Sensor Flip Chip Package
Application:
17/157,302 →
Publication:
US 2021/0143199
Semiconductor Packages Using Package in Package Systems and Related Methods
Mimo Channel Extenders with Associated Systems and Methods
Molded Image Sensor Chip Scale Packages and Related Methods
Adaptive Thermal Management in Wireless Communications Systems
Methods of Forming Semiconductor Packages with Back Side Metal
Analog Switch Multiplexer Systems and Related Methods
Electronic Device Including a Gate Structure and a Process of Forming the Same
Flexible Distributed Antenna Array
Adjustable Low Current in a Sensor Network
Managing Power Disruptions in a Sensor Network
Offset Cancel Systems and Methods for Resolver-Type Sensors
Image Pixels with Coupled-Gates Structures
Patent:
11,323,644 →
Application:
17/178,416 →
Semiconductor Device
Integrated Electromagnetic-Acoustic Sensor and Sensing
Monitoring of Interconnect Lines
Diode Systems and Related Methods
Application:
17/188,466 →
Publication:
US 2022/0278171
Pre-Emphasis Buffer Systems and Related Methods
Battery System for Battery Degradation Estimation
Battery Charge Support System for Reducing Energy Loss
Systems and Methods of Echo Reduction
Resonant Converter with Dual-Mode Control
Power Adapters with Multiple Charging Ports
High Voltage Diode on Soi Substrate with Trench-Modified Current Path
Vertical Transistors with Gate Connection Grid
Fin Frame Assemblies
Backside Metal Patterning Die Singulation System and Related Methods
Methods and Structures for Contacting Shield Conductor in a Semiconductor Device
Average Inductor Current Regulation for Power Converters
Application:
17/248,039 →
Publication:
US 2022/0217823
System and Method for Controlling Switching Power Supply
Voltage Pre-Regulator Having Positive and Negative Feedback
Circuit and Method for Controlling a Coil Current During a Soft Shut Down
Mosfet Device with Undulating Channel
Image Sensor with Delta Sigma Modulators and Shared Filters
Image Sensor Package Having a Cavity Structure for a Light-Transmitting Member
Application:
17/248,209 →
Publication:
US 2022/0223641
Photodiode with Improved Responsivity
Application:
17/248,307 →
Publication:
US 2022/0231177
Methods and Apparatus for Reordering Signals
Molded Packaging for Wide Band Gap Semiconductor Devices
Dielectric Lattice with Capacitor and Shield Structures
Dielectric Lattice with Passive Component Circuits
Trench Gate Transistors with Low-Resistance Shield and Gate Interconnects
Methods and Apparatus for an Amplifier Circuit
Application:
17/248,428 →
Publication:
US 2021/0152137
Trench Gate Field-Effect Transistors with Drain Runner
Method and System of a Quasi-Constant on-Time Controller
Structure and Method for Electronic Die Singulation Using Alignment Structures and Multi-Step Singulation
Application:
17/248,514 →
Publication:
US 2021/0296176
Image Sensors Having Readout Circuitry with a Switched Capacitor Low-Pass Filter
Application:
17/248,515 →
Publication:
US 2022/0239855
Package Including Multiple Semiconductor Devices
System Watchdog Timer for a Data Processing System
Process of Forming an Electronic Device Including a Non-Volatile Memory Cell
Method of Separating Electronic Devices Having a Back Layer and Apparatus
Through-Substrate via Structure and Method of Manufacture
Voltage Regulator Having Circuitry Responsive to Load Transients
Two-Capacitor Digital-to-Analog Converter
Semiconductor Devices with Class Iv Channel Region and Class Iii-V Drift Region
Application:
17/248,983 →
Publication:
US 2022/0262945
Silicon Photomultipliers for Positron Emission Tomography Imaging Systems
Application:
17/248,985 →
Publication:
US 2022/0260736
Hemt Devices with Reduced Size and High Alignment Tolerance
Delaying Rendering Time for Audio Computing Systems
Ultra-Thin Multichip Power Devices
Methods and Apparatus for Reporting a Relative State of Charge of a Battery
Image Sensor with Active Capacitance Cancellation Circuitry to Reduce Pixel Output Settling Time
Methods and Apparatus for Optical Image Stabilization
Patent:
11,223,767 →
Application:
17/249,256 →
Method and Apparatus Related to Controllable Thin Film Resistors for Analog Integrated Circuits
Application:
17/249,279 →
Publication:
US 2022/0271118
Image Sensors Having Dielectric Relaxation Correction Circuitry
Patent:
11,336,848 →
Application:
17/249,430 →
Image Sensor with Reduced Column Fixed Pattern Noise
Fan-Out Wafer Level Packaging of Semiconductor Devices
Application:
17/249,436 →
Publication:
US 2022/0285267
Method and System of a Power Converter with Secondary Side Active Clamp
Patent:
11,349,401 →
Application:
17/249,439 →
Electronic Device Packaging with Galvanic Isolation
Methods and Apparatus for an Image Sensor
Image Sensors with Reduced Peak Power
Systems and Methods for Mitigating Global Event Power Surge in Image Sensors
Methods and Apparatus for Optical Image Stabilization
Short Circuit Detection Circuit
Methods and Apparatus for Optical Image Stabilization
Wi-Fi Adaptive Triband Mesh Management
Application:
63/136,408 →
Systems and Methods for an Imaging Device with Transmissive Electronic Shutter
Application:
63/138,918 →
Robust Data Transmission
Application:
63/144,353 →
Apparatus and Methods for an Image Sensor
Application:
63/150,799 →
Semiconductor Devices and Methods
Application:
63/162,962 →
Semiconductor Devices and Methods
Application:
63/166,242 →
Forming Shield Contacts in a Shielded-Gate Trench Power Mosfet
Application:
63/166,919 →
Echo Canceller with Variable Step-Size Control
Application:
63/167,384 →
Method and System of a Power Converter with Secondary Side Active Clamp
Application:
63/199,788 →
Precision Operational Amplifier Using Floating Input Stage
Application:
63/199,945 →
Methods and Apparatus for an Image Sensor
Application:
63/200,127 →
Precision Operational Amplifiers and Methods
Application:
63/200,551 →
Multiphase Power Converter with Clc Resonant Circuit
Application:
63/200,622 →
Regulation and Monitoring Circuits
Application:
63/200,743 →
Feedforward Method for Average Current Regulation
Application:
63/200,744 →
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 7, 2021
From: BANERJEE, ABHISHEK; MOENS, PETER; DE VLEESCHOUWER, HERBERT; COPPENS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 054843/0557 →
Assignment of Assignor's Interest
Jan 7, 2021
From: COENEN, IVO LEONARDUS; MITCHLER, DENNIS WAYNE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 054844/0052 →
Assignment of Assignor's Interest
Jan 7, 2021
From: HSIEH, YU-TE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 054844/0136 →
Assignment of Assignor's Interest
Jan 11, 2021
From: QUDDUS, MOHAMMED TANVIR; MUDHOLKAR, MIHIR; HOSSAIN, ZIA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 054874/0993 →
Assignment of Assignor's Interest
Jan 12, 2021
From: HYNECEK, JAROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 054895/0495 →
Assignment of Assignor's Interest
Jan 25, 2021
From: SUCHY, TOMAS; KOSTELNIK, PAVEL; HUSTAVA, MAREK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055014/0044 →
Assignment of Assignor's Interest
Jan 25, 2021
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055021/0225 →
Assignment of Assignor's Interest
Jan 25, 2021
From: ELAD, DANNY; CORCOS, DAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055018/0175 →
Assignment of Assignor's Interest
Jan 28, 2021
From: ELAD, DANNY; CORCOS, DAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055065/0082 →
Assignment of Assignor's Interest
Jan 29, 2021
From: YOO, INPIL; ESTACIO, MARIA CRISTINA; TEYSSEYRE, JEROME; IM, SEUNGWON
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055074/0474 →
Assignment of Assignor's Interest
Jan 29, 2021
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055075/0697 →
Assignment of Assignor's Interest
Feb 1, 2021
From: KUROSE, EIJI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055092/0632 →
Assignment of Assignor's Interest
Feb 2, 2021
From: TAKI, KONOSUKE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055110/0681 →
Assignment of Assignor's Interest
Feb 10, 2021
From: CONSTANT, AURORE; BAELE, JORIS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055211/0228 →
Assignment of Assignor's Interest
Feb 16, 2021
From: AMINI, PEIMAN; AMIRI, BAHADOR; LOPEZ, HECTOR; CATTET, STEPHANE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055271/0050 →
Assignment of Assignor's Interest
Feb 16, 2021
From: AGRAWAL, ABHISHEK KUMAR; WANG, HUIZHAO; AMINI, PEIMAN; SCHELSTRAETE, SIGURD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055272/0633 →
Assignment of Assignor's Interest
Feb 16, 2021
From: STEPAN, MIROSLAV; HUSTAVA, MAREK; SUCHY, TOMAS; HARTL, PAVEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055276/0385 →
Assignment of Assignor's Interest
Mar 1, 2021
From: SUCHY, TOMAS; STEPAN, MIROSLAV; HARTL, PAVEL; HUSTAVA, MAREK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055448/0322 →
Release of Security Interest
Oct 1, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057674/0203 →
Assignment of Assignor's Interest
Aug 8, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: AY DEE KAY LLC DBA INDIE SEMICONDUCTOR
Reel/Frame 060744/0472 →
Release of Security Interest
May 2, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063516/0756 →
Assignment of Assignor's Interest
May 8, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: MAXLINEAR, INC.
Reel/Frame 063572/0701 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →