Dielectric lattice with capacitor and shield structures
In a general aspect, a semiconductor device can include a semiconductor region, an active region disposed in the semiconductor region, and a termination region disposed on the semiconductor region and adjacent to the active region. The termination region can include a trench having a conductive material disposed therein. The termination region can further include a first cavity separating the trench from the semiconductor region. A portion of the first cavity can be disposed between a bottom of the trench and the semiconductor region. The termination region can also include a second cavity separating the trench from the semiconductor region.
1. A semiconductor device comprising:
a semiconductor region;
an active region disposed in the semiconductor region; and
a termination region disposed on the semiconductor region and adjacent to the active region, the termination region including:
a trench having a conductive material disposed therein;
a first cavity separating the trench from the semiconductor region, a portion of the first cavity being disposed between a bottom of the trench and the semiconductor region; and
a second cavity separating the trench from the semiconductor region.
2. The semiconductor device of claim 1 , wherein:
the portion of the first cavity is a first portion of the first cavity;
a second portion of the first cavity is disposed along a first sidewall of the trench; and
a portion of the second cavity is disposed along a second sidewall of the trench.
3. The semiconductor device of claim 1 , wherein the termination region further includes:
a three-dimensional dielectric film lattice defining a plurality of cavities including the first cavity and the second cavity,
a first sidewall of the trench, a second sidewall of the trench, and the bottom of the trench being defined by a portion of the three-dimensional dielectric film lattice, the first sidewall of the trench, the second sidewall of the trench, and the bottom of the trench being disposed on the conductive material.
4. The semiconductor device of claim 3 , wherein the portion of the three-dimensional dielectric film lattice defining the trench, along a vertical line orthogonal to the semiconductor region, is suspended above the semiconductor region.
5. The semiconductor device of claim 4 , wherein the portion of the three-dimensional dielectric film lattice defining the trench is suspended above the semiconductor region by a dielectric film of the three-dimensional dielectric film lattice.
6. The semiconductor device of claim 5 , wherein:
the dielectric film of the three-dimensional dielectric film lattice is a first dielectric film;
the termination region further includes a pillar of the semiconductor region disposed within a second dielectric film, the pillar of the semiconductor region defining a first plate of a capacitor;
the conductive material defines a second plate of the capacitor; and
the first dielectric film, the second dielectric film and the first cavity define, at least in part, a dielectric of the capacitor.
7. The semiconductor device of claim 1 , wherein the conductive material is doped polysilicon.
8. The semiconductor device of claim 1 , wherein:
the termination region further includes a pillar of the semiconductor region disposed within a dielectric film, the pillar of the semiconductor region defining a first plate of a capacitor;
the conductive material defining a second plate of the capacitor;
the dielectric film and the first cavity defining, at least in part, a dielectric of the capacitor.
9. The semiconductor device of claim 8 , further comprising:
a transistor disposed in the active region,
the conductive material being electrically coupled with one of a gate terminal or a base terminal of the transistor, and
the pillar of the semiconductor region being electrically coupled with one of a drain terminal or a collector terminal of the transistor.
10. The semiconductor device of claim 8 , further comprising:
a transistor disposed in the active region,
the conductive material being electrically coupled with one of a source terminal or an emitter terminal of the transistor, and
the pillar of the semiconductor region being electrically coupled with one of a drain terminal or a collector terminal of the transistor.
11. The semiconductor device of claim 1 , wherein the trench is disposed along a perimeter of the active region.
12. The semiconductor device of claim 1 , wherein:
the termination region further includes a pillar of the semiconductor region disposed within a dielectric film, the trench being disposed between the active region and the pillar, the first cavity separating the trench from the pillar.
13. A capacitor comprising:
a semiconductor region defining a first plate of the capacitor;
a trench having a conductive material disposed therein, the conductive material defining a second plate of the capacitor; and
a cavity separating the trench from the semiconductor region, a portion of the cavity being disposed between a bottom of the trench and the semiconductor region, the cavity being included in a dielectric of the capacitor.
14. The capacitor of claim 13 , further comprising:
a three-dimensional dielectric film lattice defining a plurality of cavities including the cavity separating the trench from the semiconductor region,
a first sidewall of the trench, a second sidewall of the trench, and a bottom of the trench being defined by the three-dimensional dielectric film lattice, the first sidewall of the trench, the second sidewall of the trench, and the bottom of the trench being disposed on the conductive material.
15. The capacitor of claim 14 , wherein the cavity is a first cavity, the capacitor further comprising:
a second cavity separating the trench from the semiconductor region, a portion of the three-dimensional dielectric film lattice separating the first cavity from the second cavity.
16. The capacitor of claim 13 , wherein the semiconductor region includes a semiconductor pillar included in the first plate of the capacitor, the cavity being disposed between the trench and the semiconductor pillar.
17. A semiconductor device comprising:
a semiconductor region;
an active region disposed in the semiconductor region;
a transistor disposed in the active region; and
a termination region disposed on the semiconductor region and adjacent to the active region, the termination region including:
a trench having a conductive shield material disposed therein;
a first cavity separating the trench from the semiconductor region, a portion of the first cavity being disposed between a bottom of the trench and the semiconductor region; and
a second cavity separating the trench from the semiconductor region.
18. The semiconductor device of claim 17 , wherein the termination region further includes:
a three-dimensional dielectric film lattice defining a plurality of cavities including the first cavity and the second cavity,
a first sidewall of the trench, a second sidewall of the trench, and a bottom of the trench being defined by the three-dimensional dielectric film lattice, the first sidewall of the trench, the second sidewall of the trench, and the bottom of the trench being disposed on the conductive shield material.
19. The semiconductor device of claim 17 , further comprising a metal layer electrically coupled with one of a source terminal or an emitter terminal of the transistor, the metal layer being disposed over the trench.
20. The semiconductor device of claim 17 , further comprising a metal layer electrically coupled with one of a gate terminal or a base terminal of the transistor, the metal layer being disposed over the trench.