Patent Assignment
Reel/Frame 055074/0474
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 8
Assignors
YOO, INPIL
Executed: 2021-01-22
ESTACIO, MARIA CRISTINA
Executed: 2021-01-25
TEYSSEYRE, JEROME
Executed: 2021-01-26
IM, SEUNGWON
Executed: 2021-01-28
EOM, JOOYANG
Executed: 2021-01-26
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Packages Using Package in Package Systems and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 15, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 056595/0177 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →