Patent Application
Utility
App. No. 17/157,302
· Confirmation No. 5856
IMAGE SENSOR FLIP CHIP PACKAGE
Inventor:
Weng-Jin WU
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2023-04-03 | ABN |
Abandonment | 2 | View | |
| 2022-09-21 | CTNF |
Non-Final Rejection | 8 | View | |
| 2022-09-21 | 892 |
List of references cited by examiner | 1 | View | |
| 2022-09-21 | SRFW |
Search information including classification, databases and other search related notes | 1 | View | |
| 2022-09-21 | FWCLM |
Index of Claims | 1 | View | |
| 2022-09-21 | SRNT |
Examiner's search strategy and results | 1 | View | |
| 2022-09-21 | 1449 |
List of References cited by applicant and considered by examiner | 4 | View | |
| 2022-09-21 | BIB |
Bibliographic Data Sheet | 1 | View | |
| 2022-09-21 | SRNT |
Examiner's search strategy and results | 6 | View | |
| 2021-05-13 | NTC.PUB |
Notice of Publication | 1 | View | |
| 2021-02-05 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2021-02-05 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2021-01-25 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 4 | View | |
| 2021-01-25 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2021-01-25 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2021-01-25 | ADS |
Application Data Sheet | 8 | View | |
| 2021-01-25 | SPEC |
Specification | 22 | View | |
| 2021-01-25 | CLM |
Claims | 5 | View | |
| 2021-01-25 | ABST |
Abstract | 1 | View | |
| 2021-01-25 | DRW |
Drawings-only black and white line drawings | 15 | View | |
| 2021-01-25 | OATH |
Oath or Declaration filed | 1 | View | |
| 2021-01-25 | PA.. |
Power of Attorney | 2 | View |
Inventors
Weng-Jin WU
Hsinchu City, TAIWAN
Attorneys & Agents of Record
Classification
USPC
257/434
H10F77/50
H10F39/8057
H10F77/933
H10F39/026
H10F39/809
H10F39/804
H10F39/024
H10F39/811
Prosecution
- Examiner
- OJEH, NDUKA E
- Art Unit
- 2892
- Customer No.
- 132194
- Docket No.
- ONS02969C01US
- Confirmation No.
- 5856
Publication
- Pub. No.
- US20210143199A1
- Pub. Date
- 2021-05-13
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 056595, FRAME 0177
Recorded 2023-08-16
SECURITY INTEREST
Recorded 2021-06-15
from
WU, WENG-JIN
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2021-01-25
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Quick Facts
- App. No.
- 17/157,302
- Filed
- 2021-01-25
- Pub. No.
- US20210143199A1
- Examiner
- OJEH, NDUKA E
- Art Unit
- 2892
External Links