Patent Assignment
Reel/Frame 055075/0697
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 3
Assignor
WU, WENG-JIN
Executed: 2017-01-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Molded Image Sensor Chip Scale Packages and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 15, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 056595/0177 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →