Patent Assignment
Reel/Frame 055027/0190
Assignment of Assignor's Interest
Recorded: 2021-01-26
Pages: 7
Assignors
SMITH, MATTHEW DAVID
Executed: 2021-01-18
ONO, HIROSHI
Executed: 2021-01-18
KAJIWARA, YOSUKE
Executed: 2021-01-19
MUKAI, AKIRA
Executed: 2021-01-18
KURAGUCHI, MASAHIKO
Executed: 2021-01-18
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same