Patent Assignment
Reel/Frame 055051/0058
Assignment of Assignor's Interest
Recorded: 2021-01-20
Pages: 45
Assignors
WASEDA, TAKAYUKI
Executed: 2021-01-13
NAKAGAWA, TAKASHI
Executed: 2021-01-13
NAKATANI, KIMIHIKO
Executed: 2020-12-14
DEGAI, MOTOMU
Executed: 2021-01-13
IZAKI, TAKAO
Executed: 2020-12-27
HASHIMOTO, YOSHITOMO
Executed: 2020-12-14
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Methods of Processing Substrate and Manufacturing Semiconductor Device by Forming Film, Substrate Processing Apparatus, and Recording Medium