Patent Assignment
Reel/Frame 055051/0825
Assignment of Assignor's Interest
Recorded: 2021-01-27
Pages: 8
Assignors
PARK, SAEHAN
Executed: 2021-01-26
YIM, JEONGHYUK
Executed: 2021-01-25
KIM, KI-IL
Executed: 2021-01-25
SON, GIL HWAN
Executed: 2021-01-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Backside Power Distribution Network Semiconductor Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.