Patent Assignment
Reel/Frame 055054/0615
Assignment of Assignor's Interest
Recorded: 2021-01-27
Pages: 3
Assignor
YANG, PO-YU
Executed: 2020-12-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Hybrid Bonding Structure and Method of Fabricating the Same