Patent Assignment
Reel/Frame 055054/0631
Assignment of Assignor's Interest
Recorded: 2021-01-27
Pages: 4
Assignors
WANG, SHENG-CHEN
Executed: 2021-01-03
LIN, MENG-HAN
Executed: 2020-12-22
YEONG, SAI-HOOI
Executed: 2020-12-22
LIN, YU-MING
Executed: 2021-01-03
CHIA, HAN-JONG
Executed: 2020-12-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Memory Device and Manufacturing Method Thereof