Patent Assignment
Reel/Frame 055056/0717
Assignment of Assignor's Interest
Recorded: 2021-01-28
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method, Substrate Processing Apparatus, and Substrate Processing System