Patent Assignment
Reel/Frame 055063/0606
Assignment of Assignor's Interest
Recorded: 2021-01-28
Pages: 6
Assignors
HSU, CHIH-HSUN
Executed: 2021-01-14
CHEN, CHI-JEN
Executed: 2021-01-14
HSU, HSI-CHANG
Executed: 2021-01-14
HSU, YUAN-HUNG
Executed: 2021-01-14
TAI, RUI-FENG
Executed: 2021-01-14
JIANG, DON-SON
Executed: 2021-01-14
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Fabrication Method Thereof